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6-2024_Chinese: Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Chinese: 印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法)
English versions: GB/T 8750-2022
English versions: GB/T 36280-2023
English versions: GB 17354-2024
English versions: GB/T 33993-2024
GB/T 9460-2023 Chinese PDF (GB/T9460-2023) GB/T 29418-2023 6-2024_Chinese: Printed board assemblies -GB T 9460 2023_Chinese: Solid wires and rods for fusion welding of copper and copper alloys (Chinese: ) Note Careful: Text of PDF is in Chinese (not English). Delivery (PDF in Chinese): 2 working hours typically, ASAP English versions: GB T 9460 2023
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