M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical the writing conditions are to

the writing conditions are to be agreed upon by the user and supplier

SEMI MF673 — Test Method for Measuring Resistivity of Semiconductor Wafers or Sheet Resistance of Semiconductor Films with a Noncontact Eddy-Current Gage

4  The described methods for identification and registration of etch pits as well as the procedures for evaluation can be applied also to monocrystalline semiconductor slices or wafers of other materials or orientations

and as the result (2) to provide magnification references which are easy for anyone to use

SEMI MF84 –– Test Method for Measuring Resistivity of Silicon Wafers with an In-Line Four-Point Probe

M04800 - SEMI M48 - Guide for Evaluating Chemical-Mechanical Polishing Processes of Films on Unpatterned Silicon Substrates Revision:SEMI M48-1101 (Withdrawn 1110) - Withdrawn - Historical the writing conditions are toThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on August 27, 2010. Initially available at www. semi. org in October 2010. Originally published November 2001. NOTICE: This document was balloted and approved for withdrawal in 2010. The purpose of this document is to provide a guide for evaluation of chemical mechanical polishing (CMP)