G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages Revision:SEMI G42-0996 (Reapproved 0318) - Inactive and the amount of deformation

and the amount of deformation induced to the wafer stack by the bonding process

SEMI E151 — Guide for Understanding Data Quality

1-1215 (technical revision)

SEMI M38 — Specification for Polished Reclaimed Silicon Wafers

which covers the measurement

G04200 - SEMI G42 - Specification for Thermal Test Board Standardization for Measuring Junction-to-Ambient Thermal Resistance of Semiconductor Packages Revision:SEMI G42-0996 (Reapproved 0318) - Inactive and the amount of deformationThis Document provides the requirements for a standard thermal resistance test board to be used in junction to ambient thermal resistance measurement of a semiconductor package under still and forced air condition as a referee method. This Document describes the thermal resistance test board for measurement of the following packages: Dual In Line Packages (DIP), Plastic Chip Carrier Package (PCC), Quad Flat Package (QFP), Pin Grid Array Package (PGA),