G09900 - SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-0820 The characteristics of encapsulation materials

The characteristics of encapsulation materials such as modulus needs to be recognized and defined to enable the qualified encapsulation processes for large panel size

There are suppliers of epitaxial layers who will grow material to the customer’s specification

SEMI G75-0698 (first published)

orgで入手可能となる。初版は2011年8月発行。

本ガイドは，MSの能力の特定の尺度を決定するための手順を記載し，次の項目を含む。

G09900 - SEMI G99 - Specification for Flowability of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-0820 The characteristics of encapsulation materialsMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular, and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of