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SEMI E5-0704 (technical revision)
together with test methods suitable for determining their magnitude
SEMI MF1048 — Test Method for Measuring the Effective Surface Roughness of Optical Components by Total Integrated Scattering
2-0624 (technical revision)
SEMI E16-0624 (technical revision)
MF181000 - SEMI MF1810 - Test Method for Counting Preferentially Etched or Decorated Surface Defects in Silicon Wafers StdPbc-0220 SEMI E5-0704 (technical revision)Defects on or in silicon wafers may adversely affect device performance and yield. Crystal defect analysis is a useful technique in troubleshooting device process problems. The type, location, and density of defects counted by this Test Method may be related to the crystal growth process, surface preparation, contamination, or thermal history of the wafer. This Test Method is suitable for acceptance testing when used with referenced standards. This
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