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SEMI C16 — Guide for Precision Reporting/Data Traceability
the applicability of this specification is not restricted or limited to this region alone
the specified bevel angle is used to determine both the regions of the measured edge profile to be fitted and the coordinates of the reference points Ai and Bi
This Practice covers the analysis of the crystallographic perfection in silicon ingots
This flange is to be mounted to the floor within the volume defined by the equipment loadport standards
G06800 - SEMI G68 - Test Method for Junction-to-Case Thermal Resistance Measurements in Air Environment for Semiconductor Packages Revision:SEMI G68-0996 (Reapproved 1104) - Superseded SEMI C16 — Guide forThe purpose of this Test Method is to determine the thermal resistance of semiconductor packages using thermal test chips. This Test Method deals with junction to case measurements of thermal resistance in air environment. The results of this Test Method are used to obtain the junction temperature. The measurement results are usually different from the results obtained by testing in the fluid bath environment described in SEMI G30 and SEMI G43. This
