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The wafer bonding technique used was oxide bonding
SEMI E5-0301 (technical revision)
主要なモジュールおよび装置全体の両方について，モジュラ式に装置の基本的な状態をトラッキングすること。
flammable colorless gas
permit the reduction of dislocation generation in the final product
G08800 - SEMI G88 - 450mmウェーハ用テープフレームの仕様 StdTpc-High Purity Piping Systems The wafer bonding technique usedglobal Assembly & Packaging Committee20101221global Audits and Reviews Subcommittee20112www. semiviews. org www. semi. org 450mm Referenced SEMI Standards None.
