E03005 - SEMI E30.5 - 計測装置の特定装置モデル StdPbc-312 and third party equipment and

and third party equipment and process control system suppliers who need to achieve equipment and process control of select process quality parameters

The front surface of the wafer is mirror polished and the back surface may be as-cut

The transport module operates across the interface plane

This Test Method is especially applicable for silicon where boron is an unintentional p-type contaminant at trace levels (<5 × 1014 atoms/cm3)

5  This Specification also provides guides for the specification of 300 and 450 mm diameter prime silicon wafers for the 32

E03005 - SEMI E30.5 - 計測装置の特定装置モデル StdPbc-312 and third party equipment andglobal Information & Control Committee20071220global Audits and Reviews Subcommittee20082www. semi. org20083CD ROM20012002 1: SEMI E30 MSEMSEMMSEMSEMI E30 Referenced SEMI Standards SEMI E5 SEMI Equipment Communications Standard 2 Message Content (SECS II) SEMI E37. 1 High Speed SECS Message Services Single Selected Session Mode (HSMS SS) SEMI E58 Automated Reliability, Availability, and Maintainability Standard (ARAMS): Concepts, Behavior, and