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This Standard covers the domain of semiconductor manufacturing equipment operation
5 The metrology examples provided in this Guide originated from industry experts and are believed to be representative of tool performance as of the year 2012
SEMI G90-0811 (Reapproved 0318)
24 Ω·cm to about 330 Ω·cm in p-type wafers)
E18400 - SEMI E184 - Specification for 300 mm Tape Frame FOUP Load Port StdPbc-0620 and location1 Purpose 1. 1 The purpose of this Specification is to define the basic interface dimensions of a load port on the semiconductor manufacturing equipment (SME), where a 300 mm Tape Frame FOUP can be loaded and unloaded. The intention of this Specification is to define a set of requirements and features to enable interoperability of load ports and Tape Frame FOUPs without limiting innovative solutions. 2 Scope 2. 1 The interface specification in this
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