3D01400 - SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products StdTpc-Substrate Carriers and Pods since non-planarity can lead to

since non-planarity can lead to problems in subsequent processing steps

This edition was approved for publication by the global Audits and Reviews Subcommittee on April 15

本スタンダードでは，FPDカラーフィルタに使用される高抵抗樹脂ブラックマトリクス（BM）の指定された特性を測定するための実施要領を確立するものとする。これらの方法は，製造，品質管理，および開発業務に応用することができる。

it has been replaced by SEMI C59

and evaluation of lines

3D01400 - SEMI 3D14 - Guide for Incoming/Outgoing Quality control and Testing Flow for 3DS-IC Products StdTpc-Substrate Carriers and Pods since non-planarity can lead toTo ensure consistent yield control of 3DS IC products, common criteria for incoming quality control (IQC) and outgoing quality control (OQC) of outsourced subassembly and test (OSAT) are needed. The generic testing flows for different 3DS IC products defined in this Guide will expedite the progress of 3DS IC testing. This Guide will define the criteria for IQC and OQC of OSATs, such as appearance, discoloration, missing ball or crack to clarify the