M08500 - SEMI M85 - Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry StdPbc-1012 if uniformly applied

if uniformly applied

SEMI T9 — Specification for Marking of Metal Lead-Frame Strips with a Two-Dimensional Data Matrix Code Symbol

1-0301 (first published)

(2) increase the void-free denuded zone depth and the bulk micro-defect density after annealing in hydrogen or argon

is on a bulk region with very short lifetime

M08500 - SEMI M85 - Guide for the Measurement of Trace Metal Contamination on Silicon Wafer Surface by Inductively Coupled Plasma Mass Spectrometry StdPbc-1012 if uniformly appliedReduction of surface metal contamination below a concentration in accordance with the ITRS road map is a key issue for silicon wafer quality for most of the leading edge technology applications. This Document provides a guide for a high sensitivity measurement of trace metal contamination on the surface of a semiconductor grade silicon wafer by using inductively coupled plasma mass spectrometry (ICP MS). This Guide describes the procedure for trace