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Specific wafer surfaces (by wafer product
This Test Method includes procedures for establishing the repeatability of the test equipment under the conditions of measurement
replaced by SEMI C71
SEMI E143-0306 (Reapproved 0324)
but does not unduly restrict module content
G06300 - SEMI G63 - Test Method for Measurement of Die Shear Strength Revision:SEMI G63-95 (Reapproved 0811) - Superseded Specific wafer surfaces (by waferThe purpose of this Test Method is to determine procedures for die shear strength testing. This Test Method shall be used for the measurement of the die shear strength when die attach paste film is used to bond a die to a leadframe substrate bond pad. This Test Method shall be used for quality control and development at die attach paste film suppliers and for incoming inspection and selection of the die attach paste film at die attach paste film
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