MF115200 - SEMI MF1152 - Test Method for Dimensions of Notches on Silicon Wafers StdPbc-0122 the reality is that each

the reality is that each fab controls its equipment with its own specification

It includes a specific transfer command state model and transport and storage system controller (TSSC) state model as the basis for all equipment of this class

This is most often seen on stepping aligners

The incorporation of this Standard may require equipment designers to include the features of the interface into the tool design

analysis and reporting of effective gate electrode work function data by the flat band voltage-insulator thickness technique

MF115200 - SEMI MF1152 - Test Method for Dimensions of Notches on Silicon Wafers StdPbc-0122 the reality is that eachWafers must be accurately aligned in various processing equipment during integrated circuit manufacture. A notch ground into the edge of the wafer at a specified orientation provides a positive method for such alignment. The accuracy of the critical dimensions of the notch controls the possible accuracy of the alignment. This Test Method may be used for process control, quality control, and incoming or outgoing inspection. Until an index of precision