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G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids StdTpc-300 mm Carriers & Physical Interfaces CFJ includes the following functionalities

SKU: 31597177828
4.6

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Description

CFJ includes the following functionalities

which may be applied with due caution to systems intended for use in other gas applications

この規格は未使用シリコン供給原材料へだけの応用で,解体物あるいは半導体産業からの廃棄物への応用ではない。

TD/GC-MS is useful for qualitative and quantitative analysis of trace-level organic compounds adsorbed on wafer surfaces

and Safety Guideline for Flammable Silicon Compounds

G02600 - SEMI G26 - Specification for Hermetic Slam Chip Carrier Lids StdTpc-300 mm Carriers & Physical Interfaces CFJ includes the following functionalitiesThis specification covers the ceramic piece part commonly referred to as a lid, used in the construction of a hermetic SLAM package with a 0. 050" pad centerline. The SLAM package is covered separately in SEMI G5. Referenced SEMI Standards None.

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