E07600 - SEMI E76 - Guide for 300 mm Process Equipment Points of Connection to Facility Services StdDcs-Replaced Charged wafer and reticle surfaces

Charged wafer and reticle surfaces attract airborne particles (electrostatic attraction [ESA]) and increase the defect rate

SEMI E109-0703 (technical revision)

This Test Method defines a particle shedding evaluation method for 25 cm filter cartridges of various media (e

The purpose of this Standard effort is to provide a common specification for concepts

(LCD) 用BLUに適用され，その測定は光学的領域のみを対象とする。その他の領域（電気的性質，信頼性など）については，他のSEMIスタンダードにより規定される。

E07600 - SEMI E76 - Guide for 300 mm Process Equipment Points of Connection to Facility Services StdDcs-Replaced Charged wafer and reticle surfacesNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. 1 Purpose 1. 1 Factory design variations make it difficult for equipment manufacturers to predict or agree on consistent points of connection for hookup of equipment to facility services. Similarly, device manufacturers