3D01300 - SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks StdTpc-3DS-IC This Guide will assist users

This Guide will assist users in selection and use of bond-void metrology equipment and a protocol for performing bond-void measurements based on their application

and addition of other gases and systems such as mixed gases

SEMI F50-0200 (Reapproved 1021)

SEMI C71-0421 (technical revision)

the requirements are presented as guides

3D01300 - SEMI 3D13 - Guide for Measuring Voids in Bonded Wafer Stacks StdTpc-3DS-IC This Guide will assist usersThis Guide will assist users in selection and use of bond void metrology equipment and a protocol for performing bond void measurements based on their application. New bonding processes and applications are sensitive to significantly smaller voids than bonding processes currently used for 3DS IC package sealing. This Guide is based on experimental data on 300 mm diameter silicon wafer pairs. The inspection and metrology tools covered include only