G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds Revision:SEMI G11-88 - Superseded PBET helps to increase productivity

PBET helps to increase productivity and reduce costs based on the metrics defined in SEMI E79 and SEMI E35

SEMI E121 — Guide for Style & Usage of XML for Semiconductor Manufacturing Applications

SEMI E109-0701 (first published)

This Test Method is particularly applicable to clean

SEMI MF1528-1107 (technical revision)

G01100 - SEMI G11 - Practice for RAM Follower Gel Time and Spiral Flow of Thermal Setting Molding Compounds Revision:SEMI G11-88 - Superseded PBET helps to increase productivityThis method describes a procedure for measuring the flow and gel characteristics of semiconductor grade transfer molding compounds using a ram follower device. Referenced SEMI Standards None.