3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack StdDcs-Superseded SEMI標準文件所處理。

SEMI標準文件所處理。

or specific components when dedicated training equipment is not available

previously published in 1996

orgで。初版は2003年3月に発行された。

This Guide provides criteria for measurement methodology for micro-bump dimensions

3D01000 - SEMI 3D10 - Guide to Describing Materials Properties for Intermediate Wafers for Use in a 300 mm 3DS-IC Wafer Stack StdDcs-Superseded SEMI標準文件所處理。1 Purpose 1. 1 This Guide is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure processed wafers to be used in a 3DS IC process. 2 Scope 2. 1 This Guide provides the tools to describe individual wafers in a 3DS IC process. In particular, this Document provides direction for describing the dimensions, materials, and devices for wafers that have undergone processing and are entering 3D stacking