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SEMI D6-0211 (Reapproved 0117)
It was replaced by SEMI C70
the value shall be expressed as a maximum permissible limit
open device level network standard
11-1106 (Reapproved 1211)
G00900 - SEMI G9 - 仕様 スタンピングによる半導体プラスチックDIPパッケージ用リードフレーム StdPbc-0512 SEMI D6-0211 (Reapproved 0117)Referenced SEMI Standards SEMI G4 Specification for Integrated Circuit Leadframe Materials Used in the Production of Stamped Leadframes SEMI G10 Standard Method of Mechanical Measurement SEMI G21 Specification for Plating Integrated Circuit Leadframes
US$ 30.00
US$ 20.00
US$ 30.00
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