G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling Revision:SEMI G16-88 - Inactive Short-Term Reproducibility

Short-Term Reproducibility

These test methods have not been tested on layered structures

SEMI S22-1110b (delayed revision)

the array coordinate system may be referenced to the physical geometry of the wafer

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G01600 - SEMI G16 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Chip Carrier Tooling Revision:SEMI G16-88 - Inactive Short-Term ReproducibilityNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document is a guideline for the ordering of tooling required to mold and form plastic chip carriers. It is to be used by packaging engineers, mold manufacturers and end of line tool makers as the basis for defining the