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but it may be established through use of the wafer coordinate system defined in SEMI M20
10-0698 (Reapproved 0706)
3 This Test Method can be used to obtain the on-wafer spatial distributions of wafer bond strength
SFQR and SFQD are well known parameters and described in detailed in SEMI MF1530
The key parameters cover the ingot diameter
C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing Revision:SEMI C100-1120 - Current but it may be establishedThis Document will provide a guide for the measurements of and reporting of more accurate parameters of hardness of chemical mechanical planarization (CMP) pads, than current industry standards. This Document will provide a guide for the measurement of and reporting of effect of the temperature on the pad hardness. Reference to this Guide can be used in the corresponding certificate of acceptance (CoA) from a CMP supplier to its customers. Reference
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