MF139000 - SEMI MF1390 - Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning StdPbc-0315 SEMI E164 — Specification for

SEMI E164 — Specification for EDA Common Metadata

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MF139000 - SEMI MF1390 - Test Method for Measuring Bow and Warp on Silicon Wafers by Automated Noncontact Scanning StdPbc-0315 SEMI E164 — Specification forThis Test Method is suitable for measuring the bow and warp of wafers used in semiconductor device processing in the as sliced, lapped, etched, polished, epitaxial or other layer condition and for monitoring thermal and mechanical effects on the bow and warp of wafers during device processing. This Test Method covers a noncontacting, nondestructive procedure to determine the bow and warp of clean, dry semiconductor wafers. This Test Method employs a