M07700 - SEMI M77 - Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA StdPbc-0525 これらの方法は，現場用液体光学式パーティクル測定装置（OPM）を使用して性能を定量化する。

これらの方法は，現場用液体光学式パーティクル測定装置（OPM）を使用して性能を定量化する。

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• A description of information and control functions needed in a semiconductor manufacturing environment

O and C from the as-received surface

The X-ray test method is nondestructive and yields the more precise measurement of orientation

M07700 - SEMI M77 - Test Method for Determining Wafer Near-Edge Geometry Using Roll-Off Amount, ROA StdPbc-0525 これらの方法は，現場用液体光学式パーティクル測定装置（OPM）を使用して性能を定量化する。Wafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer determine if the dimensional characteristics of a specimen wafer satisfy given geometrical requirements. The roll off amount (ROA) metric is suitable for quantifying near edge geometry of wafers used in semiconductor device processing. Consideration should be given to the use