C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0319 such as wafer carriers and

such as wafer carriers and wands

SEMI F44-0699 (first published)

Automated self-indexing with such communications as GPIB or RS-232C between tester and prober equipment is outside the scope of this Specification but is not precluded

マスフローコントローラ（MFC）は，好ましくない条件のもとで腐食性ガスを制御するために使用されることが多い。この試験方法は，腐蝕によって誘発される欠陥に対する相対的耐性に基づいてMFC設計を区別するのに役立つことを意図している。

This edition was approved for publication by the global Audits and Reviews Subcommittee on December 4

C09800 - SEMI C98 - Guide for Chemical Mechanical Planarization (CMP) Particle Size Distribution (PSD) Measurement and Reporting Used in Semiconductor Manufacturing StdPbc-0319 such as wafer carriers andThe purpose of this Document is to provide a guide for the measurement of and reporting of particle size distributions (PSD) for chemical mechanical planarization (CMP) slurries. Most CMP slurries have a wide range of particle sizes from a few nanometers to several hundreds of nanometers. This Guide does not define which measurement technique should be used but focuses on the parameters to report on a Certificate of Analysis (CoA) and on the roadmap