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Format: Online data access compatible with IOS
SEMI D61-1110 (first published)
but not part of the requirements) on the 200 mm wafer size
the Sensor/Actuator Network Common Device Model
This Standard covers specifications for services to and events from CLJ and CFJ models
3D00900 - SEMI 3D9 - Guide for Describing Materials Properties for a 300 mm 3DS-IC Wafer Stack StdPbc-1114 Format: Online data access compatible1 Purpose 1. 1 This Guide is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure wafer stacks to be used in a 3DS IC process. 2 Scope 2. 1 This Guide provides the tools to describe wafer stacks in a 3DS IC process. A wafer stacking process takes two or more intermediate wafers and forms a stack, which can then be further processed as if it were a single wafer. After bonding the dimensions of
US$ 649.50
US$ 2209.50
