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G05600 - SEMI G56 - リードフレーム銀めっき厚さの測定方法 Revision:SEMI G56-93 (Reapproved 0811) - Superseded ranging from legacy systems to

SKU: 50990928422
4.6

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Description

ranging from legacy systems to the latest in electronic chip identification (ECID) and 2D code package marking

Equipment (through reference to SEMI E78)

本文書はSEMI E54

This document will enable standardization of the strip map format and execution method throughout the factory floor

but the precision of the measurement is limited

G05600 - SEMI G56 - リードフレーム銀めっき厚さの測定方法 Revision:SEMI G56-93 (Reapproved 0811) - Superseded ranging from legacy systems toglobal Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org199320023 : SI Referenced SEMI Standards None.

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