M03300 - SEMI M33 - Test Method for the Determination of Residual Surface Contamination on Silicon Wafers by Means of Total Reflection X-Ray Fluorescence Spectroscopy (TXRF) Revision:SEMI M33-0998 (Withdrawn 1107) - Withdrawn - Historical This Standard accomplishes this by

This Standard accomplishes this by defining an operational model for testing equipment as viewed by a factory automation controller

SEMI E115-0302E (Reapproved 0816)

hard mask and copper diffusion barrier precursor

• Helium (He)

SEMI M13-0706 (Reapproved 1011)

M03300 - SEMI M33 - Test Method for the Determination of Residual Surface Contamination on Silicon Wafers by Means of Total Reflection X-Ray Fluorescence Spectroscopy (TXRF) Revision:SEMI M33-0998 (Withdrawn 1107) - Withdrawn - Historical This Standard accomplishes this byThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on September 5, 2007. It was available at www. semi. org in October 2007. Originally published September 1998. NOTICE: This document was balloted and approved for withdrawal in 2007. The test provides the analytical procedure to determine the trace level of contaminating elements of an