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Inspection equipment finds anomalies
This Specification provides for a standardized OC location in support of future unification of the OC cut shape as well as location
This Standard is applicable to FPD
One type of such defect is localized light scatterers (LLS) such as particles
The steps described are sample preparation
M07000 - SEMI M70 - Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness Revision:SEMI M70-1015 - Inactive Inspection equipment finds anomaliesWafer near edge geometry can significantly affect the yield of semiconductor device processing. Knowledge of near edge geometrical properties can help the producer and consumer to determine if the dimensional characteristics of a wafer satisfy given geometrical requirements. This Test Method is suitable quantifying the near edge geometry of wafers used in semiconductor device processing. The PSFQR or PSFQD metric is suitable for quantifying near edge
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