E03500 - SEMI E35 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment StdPbc-0813 and the amount of deformation

and the amount of deformation induced to the wafer stack by the bonding process

SEMI MF1366-1107 (technical revision)

SEMI E4-80 (first published)

relationships

The configuration of unit designs should be made per the IC chip information

E03500 - SEMI E35 - Guide to Calculate Cost of Ownership (COO) Metrics for Semiconductor Manufacturing Equipment StdPbc-0813 and the amount of deformationThe purpose of this Guide is to provide standard cost of ownership (COO) metrics for evaluating unit production cost effectiveness of manufacturing equipment in the semiconductor and related industries. This Guide establishes a procedure to facilitate an understanding of equipment related costs, including costs related to environmental, health, and safety (EHS) factors, by providing definitions, classifications, algorithms, methods, and example values