M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn 15-1107 (technical revision)

15-1107 (technical revision)

• Etch equipment (Dry and Wet)

1から1 ppmである。精度は，4つの研究所間における持ちまわり分析において，0

2-0698 (Reapproved 0710) - Guide for Writing Sensor/Actuator Network (SAN) Standard Ballots

This Standard can be used as a specification when purchasing these solder spheres

M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn 15-1107 (technical revision)This standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on November 21, 2006. It was available at www. semi. org in February 2007. Originally published in 1992; previously published March 2003. NOTICE: This document was balloted and approved for withdrawal in 2007. Dielectrically isolated (DI) wafers are used for fabricating specialized