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This Specification is directed specifically to indium phosphide wafers with one or both sides polished
SEMI E117-0303 (technical revision)
装置上，ならびに装置外部でのレシピの管理
Detailed information on the method is found in ASTM G150
instrument configuration
M01800 - SEMI M18 - シリコンウェーハ発注仕様書開発のガdイド StdPbc-1020 This Specification is directed specificallyNOTICE: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI SEMI Silicon Wafer Global Technical Committee2012830global Audits and Reviews Subcommittee20129www. semiviews. org www. semi. org1990200711 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain
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