T00700 - SEMI T7 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol Revision:SEMI T7-1102 - Superseded SEMI S8-1000 (technical revision)

SEMI S8-1000 (technical revision)

and no such recommendations are provided herein

SEMI PV83-0318 (Reapproved 0124)

This Specification is for the leadframe material that will be shipped to an etch house

本スタンダードは，以下のドライポンプの機械的および電気的インタフェースを規定する。

T00700 - SEMI T7 - Specification for Back Surface Marking of Double-Side Polished Wafers with a Two-Dimensional Matrix Code Symbol Revision:SEMI T7-1102 - Superseded SEMI S8-1000 (technical revision)This Specification is intended to provide a marking symbology that can be used to mark silicon wafers with minimal intrusion into the fixed quality area of the wafer. This Specification defines the geometric shape, size and content (including the error checking and correcting code) of a rectangular two dimensional (2D), machine readable, binary data matrix code symbol for back surface marking of double side polished silicon wafers with diameters of