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including lithographic overlay and intermittent electrical contact between metal layers in the bonded wafers
and process equipment applications
SEMI MF1811-0116 (technical revision)
suitable correlations should be performed based on process needs and structure selection
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G08900 - SEMI G89 - Specification for Leadframe Strip Size StdDcs-Current including lithographic overlay and intermittentThe purpose of this Standard is to standardize the strip size specification of leadframe. This defines the width and length of a leadframe strip. This Specification is applicable to various types of quad flat package (QFP) leadframe strips, and small outline package (SOP) leadframe strips. This Standard can be used as a specification when purchasing these leadframe. The configuration of unit designs should be made per the IC chip information. This
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