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Due to the migration to large substrate sizes in FPD production
Recognizing the importance of impurity content of gases in the manufacture of semiconductors
The trimming width
SEMI 3D4 — Guide for Metrology for Measuring Thickness
CMP criteria can be determined by metrology technology in both contact methods such as: micro profilometer
D02300 - SEMI D23 - Guide for Cost of Equipment Ownership (CEO) Calculation for FPD Equipment Revision:SEMI D23-0999 - Inactive Due to the migration toThis guide was technically approved by the global Flat Panel Display Equipment Committee and is the direct responsibility of the Japanese Flat Panel Display Equipment Committee. Current edition approved by the Japanese Regional Standards Committee on June 1, 1999. Initially available on SEMI OnLine August 1999; to be published September 1999. The purpose of this document is to provide a standard, simple CEO calculation method for evaluating FPD
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