E03800 - SEMI E38 - Cluster Tool Module Communications (CTMC) Revision:SEMI E38-1296 (Withdrawn 0307) - Withdrawn any surface damage produced during

any surface damage produced during sample preparation is to be excluded from such assessment

SEMI E17 — Guideline for Mass Flow Controller Transient Characteristics Tests

1-0709 (technical revision)

• apex lengths

and (2) errors in resistivity determination that result from uncertainties in wafer diameter

E03800 - SEMI E38 - Cluster Tool Module Communications (CTMC) Revision:SEMI E38-1296 (Withdrawn 0307) - Withdrawn any surface damage produced duringThis standard was technically approved by the global Information & Control Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on November 21, 2006. It was available at www. semi. org in February 2007 and on CD ROM in March 2007. Originally published in 1995; previously published December 1996. NOTICE: This document was balloted and approved for withdrawl in 2007. Cluster tools fulfill a need for