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This Standard establishes a Specific Equipment Model for testing equipment (TSEM)
Provisions in this Standard enable the host computer to track basic equipment performance in an automated and consistent matter
The tests covered by this Standard are as follows:
This Practice covers detection of high densities of shallow etch pits on silicon wafers doped either p- or n-type and with resistivities as low as 0
the operations or behavior provided by the Recipe Management Standard (RMS)
M00900 - SEMI M9 - Specification for Polished Monocrystalline Gallium Arsenide Wafers Revision:SEMI M9-0308 - Superseded This Standard establishes a SpecificThis Specification covers two groups of substrate requirements for monocrystalline high purity gallium arsenide wafers used in semiconductor and electronic device manufacture. Dimensional and crystallographic orientation characteristics and limits on surface defects are the only standardized properties set forth below. A complete purchase specification may require that additional physical, electrical, and bulk properties be defined. These properties
