G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 (Reapproved 0811) - Inactive orgで入手可能となる。初版は2000年10月発行。

orgで入手可能となる。初版は2000年10月発行。

This Guide focuses on the geometrical parameters of the openings (i

SEMI E125-0709 (technical revision)

SEMI C16 — Guide for Precision and Data Reporting Practices

This Standard does not apply to computing devices of programmable logic controllers (PLCs)

G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 (Reapproved 0811) - Inactive orgで入手可能となる。初版は2000年10月発行。NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers