G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages StdPbc-0120 but are common across multiple

but are common across multiple standards

このデータ構造仕様は，マスクファブ内のマスク欠陥検査装置，欠陥修正装置，レビュー装置間で扱う欠陥情報交換を，標準的ＸＭＬフォーマットを使用して行うものである。

025" lead spacing (gull wing) packages

サイドフォークリフトフランジ（オプション） (2)

SEMI E116-1017 (technical revision)

G00900 - SEMI G9 - Specification for Stamped Leadframes for Plastic Molded Dual-in-Line Semiconductor Packages StdPbc-0120 but are common across multipleNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for the stamping manufacture of leadframes for plastic molded dual in line semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers and mold