G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Stainless Steel Components SEMI MF110-1107 (Reapproved 0718)

SEMI MF110-1107 (Reapproved 0718)

このガイドは，SEMIプロセスケミカルまたはガススタンダードおよびガイドに指定された微量不純物に適用される。該当するすべての微量不純物について，校正曲線の回帰分析に基づいて，それぞれの仕様と同等またはそれ以内のMDLを決定すべきである。このガイドはSEMI仕様に対する性能の検証およびSEMIにおける新規仕様の制定の両面への適用を意図している。

and the statistical calculations of the results should remain consistent with the procedures of this Practice

SEMI E116-0623 (technical revision)

and keeping this information current

G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Stainless Steel Components SEMI MF110-1107 (Reapproved 0718)Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of