G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title previous published revision February 1998

previous published revision February 1998

determination of the optimum temperatures for measuring the oxygen concentrations in a variety of silicon samples or optimization of the oxygen peak parameters are not described in this Test Method

without requiring host or operator input

In the case of 150 mm wafers

but does not have useful (<1011 atoms/cm2) detection limits for sodium

G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title previous published revision February 1998This document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC registered outlines: Plastic Dual in Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I. C. Packages (SOIC Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title. Referenced SEMI Standards SEMI G48 Specification, Measurement Method