MF216600 - SEMI MF2166 - Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers Revision:SEMI MF2166-02 - Superseded 2-95 (Withdrawn 1109) — High-Speed

2-95 (Withdrawn 1109) — High-Speed SECS Message Services General Session (HSMS-GS)

種々のチューブフィッティング間または製造者間における比較のためにこの方法を使用する場合には，ユーザは評価されるべきチューブおよびチューブフィッティングを明確に選択しなければならない。

本スタンダードでは，ウェーハ露光装置の自動レシピ作成におけるフレーム情報について詳述する。本スタンダードでは，設計，マスク製作，ウェーハ製造プロセスの作業フローにおける通信インタフェースに焦点を当てる。

and service of semiconductor manufacturing equipment

With the standardized measurement method and a guide for standardized reporting of results

MF216600 - SEMI MF2166 - Practices for Monitoring Non-Contact Dielectric Characterization Systems Through Use of Special Reference Wafers Revision:SEMI MF2166-02 - Superseded 2-95 (Withdrawn 1109) — High-SpeedThis standard was originally published by ASTM International as ASTM F2166 02. It was formally approved by ASTM balloting procedures and adhered to ASTM patent requirements. Though ownership of this standard has been transferred to SEMI, it has not been formally approved by SEMI balloting procedures and does not adhere either to SEMI Regulations dealing with patents or to SEMI Editorial Guidelines. Available at www. semi. org October 2003, to be