PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes Revision:SEMI PV41-0912 (Reapproved 0419) - Current different from that of this

different from that of this Test Method

SEMI E87 — Specification for Carrier Management

3 — Specification for Web Services for Substrate Mapping

It does not address specific test methods or procedures for performance verification

and the existing standards for performing these tests are referenced

PV04100 - SEMI PV41 - Test Method for In-Line, Noncontact Measurement of Thickness and Thickness Variation of Silicon Wafers for PV Applications Using Capacitive Probes Revision:SEMI PV41-0912 (Reapproved 0419) - Current different from that of thisWafer thickness and its variation across a wafer are important parameters for solar cell manufacturing. Excessive thickness variations within a lot from wafer to wafer or within a wafer may negatively impact process yield and solar cell efficiency. Both parameters are part of the specification for solar cell wafers (SEMI PV22), which define a thickness range as well as an upper limit for the total thickness variation (TTV). In addition, careful