3D01100 - SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology StdVol-Facilities 本仕様は，

本仕様は，

SEMI 3D3-1123 (technical revision)

This method can also be used for other applications outside of microelectronics

This Standard is applicable to BLU for liquid crystal display (LCD) and the measurement includes only the optical area

1 mm thick (max) in a flat panel display (FPD) manufacturing facility

3D01100 - SEMI 3D11 - Terminology for Through Glass Via and Blind Via in Glass Geometrical Metrology StdVol-Facilities 本仕様は，1 Purpose 1. 1 The purpose of this Standard is to provide clear and commonly accepted definitions of through glass via (TGV) and to provide a consistent terminology for the understanding and discussion of metrology issues important them. 2 Scope 2. 1 This Standard attempts to describe measurands and geometrical features of through and blind vias in glass. 2. 2 The focus of this Standard is on geometry related metrology and measurands important for