P04000 - SEMI P40 - Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks StdPbc-0918 The values stated in SI

The values stated in SI units are to be regarded as the standard

The Test Method is based on a light sectioning technique (see Related Information 1) where patterns of line segments or spots of light are projected onto a wafer surface and the saw marks are oriented perpendicular to the direction of wafer transport

It also provides reference for typical wastewater composition

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13-0698 (first published)

P04000 - SEMI P40 - Specification for Mounting Requirements for Extreme Ultraviolet Lithography Masks StdPbc-0918 The values stated in SIThis Specification covers the mounting requirements for extreme ultraviolet lithography (EUVL) masks in select tools. This Standard details the requirements for EUVL mask mounting. The mask mount is a flat reference surface against which the mask is clamped. The specific design and material of the mask mount are not specified. The mounting requirements in this Standard apply to the EUV exposure tools. These mounting requirements may be used in other