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SEMI C23-0714 (Reapproved 0620)
The scope of this Standard lists the proposed impurity limits of trans 1
and MGV equipment to the process tool
suitable sampling techniques must be employed
Each tool should be supplied in a ‘facility ready’ state
G08600 - SEMI G86 - Test Method for Measurement of Chip (Die) Strength by Mean of 3-Point Bending Revision:SEMI G86-0217 - Superseded SEMI C23-0714 (Reapproved 0620)This Test Method defines a procedure for the evaluation of die strength by the mean of 3 point bending method. This Test Method applies only for 3 point bending method, and other methods will be defined by the separate documents. This Test Method is used to measure die strength for dies from processed wafers. Wafer thinning technology becomes popular to meet the demand for thin packages, so the die strength data is critical for the die quality and
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