G07400 - SEMI G74 - Specification for Tape Frame for 300 mm Wafers StdPbc-1012 SEMI E90-0306 (technical revision)

SEMI E90-0306 (technical revision)

It is intended to prevent confusion and misunderstanding between manufacturers and users

to be published March 2001

本仕様では，SEMI F20に従いステンレス鋼で製作された配管や部品の接ガス・接液面の特性評価に関する要求条件および仕上げの合格判定基準について定義し，また半導体製造で使用される気体と液体の管理や収納を目的としている。

SEMI M43-0418 (technical revision)

G07400 - SEMI G74 - Specification for Tape Frame for 300 mm Wafers StdPbc-1012 SEMI E90-0306 (technical revision)The purpose of this Document is to standardize the specifications for 300 mm wafer tape frames used between the dicing process and the die bonding process. This Standard documents the dimensions, characteristics, and measurement methods for 300 mm wafer tape frames. This Standard can be used as the specification sheet for tape frame upon purchasing. This Standard uses the SI unit system. Referenced SEMI Standards (purchase separately) None.