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HB01100 - SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers Revision:SEMI HB11-0121 - Current · オプションB: 能動搬送(OHTなど)で,外部ストッカーのロードポートとの間で垂直にFOUPをピック(掬う)またはプレイス(卸す)する。オプションBの概念図を図2に示す。

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· オプションB: 能動搬送(OHTなど)で,外部ストッカーのロードポートとの間で垂直にFOUPをピック(掬う)またはプレイス(卸す)する。オプションBの概念図を図2に示す。

2  Units — This Test Method uses SI units

The box opener/loader unit might not only be configured to handle boxes (that would conform to SEMI E47

Loading and unloading is assumed to take place in semi-automated and automated mode by using any kind of system or device (e

the back surface

HB01100 - SEMI HB11 - Specification for Sapphire Single Crystal Ingot Intended for Use for Manufacturing HB-LED Wafers Revision:SEMI HB11-0121 - Current · オプションB: 能動搬送(OHTなど)で,外部ストッカーのロードポートとの間で垂直にFOUPをピック(掬う)またはプレイス(卸す)する。オプションBの概念図を図2に示す。The sapphire single crystal ingot is used as a substrate material for HB LED applications. To permit common processing equipment to be used in multiple device fabrication lines, it is essential for the sapphire single crystal ingot specifications to be standardized. This Specification provides the characteristics of sapphire single crystal ingot, consisting of the physical specification, orientation, shape, and defect standard. This Specification is

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