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P01900 - SEMI P19 - 集積回路製造用メトロロジパターンセル StdPbc-0412 polishing and other corrosion rate

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Description

polishing and other corrosion rate

SEMI C28-0306 (technical revision)

Dry etch equipment

1  This Guide covers internal feeders that are used to grow single crystal silicon for the photovoltaic industry

The Test Method is based on simultaneously measuring the wafer top and bottom surface position with an aligned pair of laser triangulation sensors when the wafer passes through the gap formed between the laser triangulation sensor pair

P01900 - SEMI P19 - 集積回路製造用メトロロジパターンセル StdPbc-0412 polishing and other corrosion rateglobal Micropatterning Committee2007425global Audits and Reviews Subcommittee20076www. semi. org20077CD ROM19921996 Referenced SEMI Standards SEMI P24 CD Metrology Procedures

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