G00800 - SEMI G8 - Test Method for Gold Plating StdPbc-0418 This document is an overview

This document is an overview of the structure and contents of a suite of documents representing an application framework for the Computer Integrated Manufacturing (CIM) systems as used in semiconductor factories

This Standard describes a method to determine the effect of attitude (mounting position) of a MFC on flow span and zero

if that is required to expose the defect structures of interest

This Test Method can be used to monitor the bulk trace level elemental impurities in silicon feedstock that affect the performance of the silicon solar cell

SEMI E12-0303 (technical revision)

G00800 - SEMI G8 - Test Method for Gold Plating StdPbc-0418 This document is an overviewNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Test Method describes procedures to determine gold plating quality. These methods apply to gold plating on cofired ceramic or metal packages. The grade, hardness, and thickness of the gold plating shall be specified