3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0923 • 機械的コネクタ

• 機械的コネクタ

本安全基準之目的係在從供應至排除設定易燃性矽化合物貯存、處理及使用之最低安全與衛生標準。

production and sale for light emitting diode (LED) industry

SEMI E87-0709 (technical revision)

The scope of this Standard is limited to identifying key EQIPs for select equipment process types

3D02000 - SEMI 3D20 - Specification for Panel Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0923 • 機械的コネクタPanel level packaging (PLP) is projected to become a critical packaging process. This Specification identifies the physical properties that must be specified for the semiconductor industry to produce an equipment set for successful implementation of PLP. Many of the applications for panel packaging lines include fan out technology applications. To permit common processing equipment, standardized panel (largest external) dimensions (whether with or